High performance closed-channel cooling system using multi-channel electro-osmotic flow pumps for 3D-ICs

A multi-channel electro-osmotic flow (EOF) implemented to the closed-channel cooling system (C³S) has been developed for thermal management of stacked chips (3D-ICs). The EOF pump, which was fabricated using MEMS technology, provided driving capabilities of fluid flow through the micro channel at the P_max of 1 × 10⁴ Pa and Q_max of 38 μl/min. Cooling capability as high as 140 W/cm² was demonstrated for the first time.