Experimental comparative study between the diamond MOSFET and its conventional counterpart in high temperatures environment

An experimental comparative study of the high temperature effects between the diamond SOI MOSFET (DSM) and conventional SOI MOSFET (CSM) counterparts is performed. The Diamond layout style has demonstrated better electrical performance in high temperatures environment, mainly for high-frequency analog IC applications, regarding the same gate area, aspect ratio and bias conditions. This can be justified due to the longitudinal corner effect (LCE) and PAMDLE (parallel association of MOSFETS with different channel lengths) effects remain active in the diamond layout style at high temperature.