Broad frequency LTCC vertical interconnect transition for multichip modules and system on package applications

Various stripline structures and flip chip interconnect designs for high-speed digital communication systems implemented in low temperature co-fired ceramic (LTCC) substrates are studied in this paper. Specifically, two different transition designs from edge launch 2.4mm connectors to stripline transmission lines embedded in LTCC are discussed. After characterizing the DuPont™ 9K7 green tape, different designs are proposed to improve signal integrity for high-speed digital data. The full-wave simulations and experimental data validate the presented designs over a broad frequency band from DC to 50 GHz and beyond.