Keynote talk II: Designing tomorrow's chips

Next generation systems in such domains as wearables and Internet of Things will have capabilities for sensing, recognition and intelligence. Such systems integrate multiple hardware components — including sensors, actuators, compute and commumcations modules — together with complex software in an ultra-low power envelope. This talk will explore the needs of a design environment that is required to rapidly design such systems. A top down model-based design methodology that follows a refinement based approach will leverage such a design environment. Many of the pieces exist today at various levels of maturity, but there remain gaps that need to be addressed.