Wafer-Level Fabrication of Microcube-Typed Beam-Splitters by Saw-Dicing of Glass Substrate

This letter reports on the development of an integrated micro-optical beam splitter that can be array-arranged. The proposed wafer-level fabrication, based on 45
^°
saw-dicing of glass substrates, allows rapid and low-cost processing. In particular, it leads to high compactness and possibility of wafer-level alignment/assembly, suitable for vertically integrated imaging micro-instruments. The device, including additional out-of plane reflection for extraction of sensing beam, can be as small as 1 mm
³
.