Influence of temperature on the standard deviation of electromigration lifetimes

The electromigration (EM) lifetime standard deviation dependence on temperature for copper damascene interconnects is investigated. An analytical expression for the standard deviation as a function of temperature is obtained based on error propagation analysis applied to a typical EM-induced void growth model. It is shown that good agreement with experimental results is obtained. Furthermore, the impact of such an analysis on the extrapolation of EM lifetimes to use conditions is discussed.