Packaging induced stresses in a packaged micromechanical microphone

The emergence of micromechanical components and systems offers a viable step towards miniaturisation of electronics products. VTT Electronics has developed a capacitive microphone that is manufactured using silicon micromachining. Die bonding to silicon substrate has shown to inflict only minor stresses to the microphone performance when an elastic silicone adhesive is used. Flip chip bonding will increase the amount of stresses, especially if the substrate material is not matched to silicon in its thermal expansion.