Diamond wafer for SAW application

A three inch wafer of polycrystalline diamond on silicon has been successfully developed. High uniformity of quality of diamond and almost defect free diamond surface associated with high quality ZnO exhibit wonderful performance of diamond SAW devices. It was also observed that this material system has super high power handling capability, smaller temperature deviation compared with 36 Y cut and ST cut quartz, low phase slope characteristics in the passband, and extremely high breakdown voltage. A variety of applications are expected with the material system utilizing these features.