Novel technology for power integrity using a metal particle conductive layer

Power integrity (PI) for recent electronics circuits and systems is the most important technological issue in the field and has been addressed in important papers through several approaches[1][2]. A novel technology is used in our study only using a conductive layer of dispersed metal particles instead of copper plane. We investigate physical phenomena and some fundamental data for PI. The transmission lines which uses metal particle conductive layer(MPCL), it causes the change in a variety of electromagnetic wave transmission speeds such as increases 76% and decrease by 21%. As a result, Z11 value of power/GND plane test coupon at 5GHz is from 2.01 (ICEP2011 [3]) to 1.79 ohm. Also we made a trial PCB in which we only replaced from the power copper metal plane in the circuit board with MPCL. The voltage fluctuation was decreased about 60% using a MPCL structure. Our developed MPCL structure has excellent characteristics not only for PI but also SI in the desirable high-frequency region. This phenomenon must be clarified as the physical basis for more progressive PI and SI issues. We suppose that these characteristic is due to interactions between electromagnetic wave and metal surface electrons. So we think that the morphology of MPCL must be an important point of improving PI and SI in the desirable high frequency region.