High-performance integrated fan-out wafer level packaging (InFO-WLP): Technology and system integration

Integrated fan-out wafer-level packaging (InFO-WLP) technology with state-of-the-art inductors (quality factor of 42 and self-resonance frequency of 16 GHz) has been demonstrated for heterogeneous integration of digital and radio frequency (RF) systems. InFO-WLP promises superior form factor, pin count, and thermal performance to existing flip-chip ball grid array (FC-BGA) packages. In addition, InFO-WLP's high Q inductors can enhance electrical performance and lower power consumption in RF circuit applications.