Parameterized modeling and thermal analysis of high-power LED package with GMSH and GetDP

We develop a method of parameterized modeling and FEM (Finite Element Method) analysis for high-power LED package with GetDP and GMSH. GMSH is applied on preprocessing and post-processing and GetDP works as a FEM solver. In our paper we show the Bottom-Up parameterized modeling method that is very useful for studying high-power LED package processes. A real high-power LED package is analyzed here and we can calculate the influence of geometrical factors on the processes interfaces.