A quick turn packaging solution and its application

With the rapid development of semiconductor industry, reducing time-to-market and cost become very important for manufacturing companies during product development. Generally, customized substrate is required for each chip design in IC packaging. However, design and manufacture of customized substrate usually take several weeks, which significantly impact cycle time of product development. To solve the problem, some companies offer Ceramic Open Tooled Package (COTP), which is very expensive and challenging for assembly. In this paper, organic-based Multi-Program Package (MPP) is proposed and analyzed as an efficient and low cost solution to accelerate packaging development, especially for pilot run of packaging.