Single-mode bi-directional links for fiber-in-the-loop and optical networks

This paper is a review of the present status of an ARPA sponsored program to develop low cost serial links. In particular, this team has focused its efforts on the development of bi-directional links which offer the special feature of sending information in both directions over a single fiber in order to eliminate half the cost of the fiber hardware in the network. Furthermore, this program leverages on the portfolio of technologies provided by the team members to provide a demonstration of a new design for the modules and a new way of manufacturing the modules in order to substantially reduce cost. Team member AMP Incorporated provides manufacturing methods for silicon waferboard assembly, connectors and packaging, Digital Optics provides novel holograms for a bi-directional optic as well as high speed ASIC design, GTE Laboratories provides advice on network requirements and silicon waferboard technology invented at GTE, BroadBand Technologies provides customer input for module requirements for their Digital Flex network for fiber-in-the-loop, the University of Colorado provides modeling for the modules and software for computer integrated manufacturing, Lasertron provides coolerless semiconductor laser die suitable for passive alignment, and Write Laboratories provides oversight and advice on behalf of ARPA.