Correlation between lifetime, temperature, and electrical stress for gate oxide lifetime testing

A relationship between the gate oxide lifetime (t/sub bd/), temperature (T), and the electrical stress for the reliability testing is investigated. Based on the various lifetime testing results reported by previous investigators, a new parameter for the oxide lifetime prediction is introduced. The parameter T[log(t/sub bd/)+C], where C is a constant, has a linear relationship with respect to the electrical stress field in the oxide. By using the above parameter, it becomes easy to describe and compare the characteristics of oxide reliability on one graph.