Multi-scale, multi-physics analysis for device, chip, package, and board level

Summary form only given. The computer integrated circuitmn (IC) is inundated with electromagnetic signals. These signals are omnipresent at the device, chip, package, and board level. The length-scales vary from nanometers to centimeters. The physics also changes significantly over these length-scales. It is clear that multi-scale, multi-physics analyses are needed to understand future generation IC's.