Integrated board-level phased array antenna solution for 60 GHz radio

A novel integrated board-level phased array antenna package devised using low-cost, high volume PCB (FR4) is presented. The presented antenna topology eliminates the need for ball grid array (BGA)/land grid array (LGA) type surface mount packaging as the antenna is directly embedded in the circuit board. This results in significant reduction in fabrication and mass production cost. A multi-element array antenna prototype is simulated, fabricated and measured and its performance is determined to be applicable for gigabit WiFi such as WiGig and IEEE 802.11ad.