A 122 GHz four element patch array fed by electromagnetic coupling

A 122 GHz antenna design is presented that allows integrating the antenna into a plastic chip package together with the semiconductor chip. The antenna uses an air-cavity within the center die pad to improve the bandwidth-efficiency product. Parasitic patches are used to create an array configuration with the intention of reducing the effect of surface waves. Measurements of the antenna prototype in the package, as well as a study on the influence of the package lid onto the antenna performance are given.