Shielded high performance interconnect technology dramatically increases real signal density

Teradyne has developed a highspeed, high-density board-to-board interconnect, called VHDM, which will meet most industry needs with respect to mechanical and electrical characteristics. An extremely robust connector will be described with excellent mechanical attributes which also dramatically increases pin density and maintains a high level of signal integrity. This connector will provide up to 101 real signals per linear inch at sub-500ps risetimes for differential or single-ended applications. The paper will focus on the mechanical and electrical performance challenges that were overcome during the design of the product.