Localized electrochemical plating of interconnectors for microelectronics

This work demonstrates the electrodeposition of micrometer scale copper structures including columns and interconnectors. Copper interconnectors of 25 /spl mu/m width were grown within an integrated circuit package using a simple instrument based on the scanning electrochemical microscope. In the present instrument electrodeposition is localized by applying a voltage between a closely spaced glass insulated Pt disk tip (diameter ca. 25 /spl mu/m) and a substrate, all immersed in a plating solution of acidified CuSO/sub 4/. The parameters that affect the deposition process are also addressed.