Low cost system-in-package module using next generation low loss organic material

Miniaturization of wireless sub-systems through high-density integration of actives and passives is in hour of need with the increasing demand for portable devices. Considering that a thin, planar form-factor is much sought-after for mobile devices, it is essential to shrink packages in terms of thickness. This paper presents, for the first time, super-thin, three-metal-layer WLAN LNA and receiver modules with chip-last embedding pioneered by Georgia Tech Packaging Research Center (GT-PRC). The modules composed of a thin organic core and an organic build up layer measure 130 um in thickness, which is smaller by a factor of nearly 10× compared to the conventional wire-bonding or flip-chip packages. Such miniaturization was primarily achieved by shrinking of embedded passives with the use of next generation material X-L (high Dk) with high dielectric constant. The modules were fabricated using conventional low cost process with the addition of cavity fabrication through laser ablation, followed by embedding of 100 um-thick GaAs dies. The receiver module was measured to have a gain of 9.2 dB at 2.4 GHz, and out-of-band rejection of nearly 30 dB at 2 GHz and 5 GHz.