Wafer-level chip scale MEMS oscillator for wireless applications

This invited paper presents the first chip-scale packaged MEMS oscillator solution that meets the stringent requirements for cellular applications. The temperature compensated MEMS oscillator (TCMO™) meets the frequency stability requirement of ±2.5 ppm from -30°C to +85°C, phase noise of -130 dBc/Hz at 1 kHz for a 13 MHz carrier, start-up time of below 2.5 ms and current consumption of less than 5 mA. With dimensions of 1.44×1.04×0.55 mm
³
the MEMS oscillator requires less than half the volume of the smallest 2016 TCXO. Importantly, due to the hermetic chip-scale package it can be integrated with larger ICs and SAW/BAW components into larger overmolded modules.