A compact system-in-package integration of X band receiving module

A novel three dimensional system-in-package (SIP) transition in a standard multi-layer Low Temperature Co-fired Ceramic (LTCC) was proposed. Then this technology was applied to a kind of receiving module. The receiver module exhibits the total receiving gain of 35 dB, noise feature of 3 dB and very low RMS phase error of 3°. The design results in a small size (15.8 mm ×7.6 mm ×3.8 mm) and low weight (3 g).