Finite element analysis of PWB warpage due to cured solder mask-sensitivity analysis

This paper describes the impact of different types of cured solder mask and mask thicknesses on printed wiring board (PWB) warpage. Finite element analysis (FEA) was used to study the sensitivity of board warpage to changes in the mask material properties (different types of solder mask), and to variations in mask thickness. The sensitivity analysis of the influence of cured solder mask and variations in mask thickness on PWB warpage are the focus of this paper. The study reported in this paper was carried out with four different board designs, and the results are presented here. The results of these analyses have resulted in general guidelines which should be observed when selecting masking materials.