High speed replication of sub-micron features on large areas by X-ray lithography

We have developed, and describe herein, a new approach to X-ray lithography based on the use of X-rays with wavelengths of 4-6 Å rather than the 8-34 Å wavelength used in previous work. The principal advantage of the shorter wavelengths is that they allow the exposure system to have X-ray windows for increased throughput. We have achieved the replication of submicron size features in metal films using a 4.6 Å Rh L
_α
source, a new X-ray mask and new X-ray resist with high sensitivity to the shorter wavelengths and improved ion milling techniques.