Half-Terahertz SiGe BiCMOS technology

This paper addresses the integration of a new generation of high-speed SiGe HBTs with f
_T
/ f
_max
of 300/500 GHz and minimum CML ring oscillator gate delays of 2.0 ps in a 0.13 μm BiCMOS technology. Technological measures for improving the speed of the HBTs compared to our first 0.13 μm BiCMOS generation are discussed. These include scaling of lateral device dimensions and doping profiles as well as a reduced thermal budget and reduced salicide resistance.