Full wafer level stacking without TSV applications to memory-only and heterogeneous SiP

A technological break based on Wafer Level Package started in 2002; consists in only stacking Known Good Rebuilt Wafer (what Freescale named: RCP and Infineon named e-Wlb) instead of standard wafers. This approach allows to have a very good yield, on the contrary of the W2W with TSV technologies. Several applications will be presented on the medical area, industrial area and smart card area.