A 77-GHz antenna in package

A novel 77-GHz directional folded dipole antenna integrated in an embedded wafer level ball grid array (eWLB) package is presented. For the characterization of the antenna a frequency multiplier is embedded, which scales the 4.25-GHz input signal up to 76.5 GHz and allows the use of a commercial signal source. The antenna structure is manufactured at the metallic layer, in the fan-out area of the package, and directly connected to the monolithic integrated frequency multiplier. The gain of the antenna is about 7dBi, measured over a large bandwidth of about 8 GHz. The combination of the frequency multiplier with the on-package antenna is a promising approach to future radar modules in a single eWLB package for automotive radar applications. Such a module avoids 77-GHz transitions to the PCB and hence simplifies the design and manufacturing of the radar sensor significantly.