Analysis of temperature field of Embedded Multi-Chip Module

For the Embedded Multi-Chip Module, the placement of the chip directly affects the internal temperature distribution, thereby affecting the reliability. In this paper, taking Embedded Multi-Chip Module as the research object, using ANSYS software to establish embedded type MCM model, performing finite element analysis of Embedded Multi-Chip Module temperature field under the condition of different substrates, different air convection coefficient and the use of heat sink, obtaining temperature distribution of Embedded-type MCM. The results show that different substrates and different air convection coefficient will affect the chip temperature distribution; using heat sink can significantly reduce the chip temperature.