SMD reliability research base on Stolkarts fatigue model

The article mainly focus on the reliability of the solder joints between the PCB and SMD in the situation like transporting and restoring, etc, provide theory evidence to enhance the reliability of such devices, ANSYS simulation tool serviced for modeling PCB, SMD and the joint structures, analyzed the maximum and the minimum stress position of the model, lower stress was loaded on the model to simulate the transferring action, then based on the Stolkarts fatigue model to predict the lifetime of these components, calculated the theory lifetime of the model, compared with the experiment, finally proved that Stolkarts fatigue model has actual ability to calculate the lifetime of devices which under certain stress value.