TFSOI technology for portable wireless communication systems

Recent growth in the portable wireless communication market has driven semiconductor technologies toward voltage and power reduction. The reduced junction capacitance and near-ideal MOS device characteristics of SOI provides an inherent advantage for low-voltage low-power applications. Substantial progress in applying SOI technology for these applications has been demonstrated in recent years. The quest for a single chip system has also initiated work in developing high frequency and analog SOI circuits. In this paper, the application of Thin-Film-Silicon-On-Insulator (TFSOI) technology for wireless communication systems is reviewed and future development discussed.