122 GHz antenna-integration in a plastic package based on a flip chip interconnect

The paper introduces a packaging concept for the integration of a 122 GHz MMIC and a separate off-chip antenna into a plastic QFN package. The concept is explained and the advantages compared to previous concepts are given. As the concept incorporates a 122 GHz chip to antenna interconnect based on flip chip technology, measurements and simulations of such an interconnect are presented to evaluate the performance. Finally, a possible antenna design is presented together with the measurement results of this antenna.