MEMS an alternative paradigm for ATE RF designers

The problem in the field of electronics has always been how to reduce the size, weight and power consumption of devices without sacrificing speed, bandwidth, or the specifications delivered via discrete or semiconductor technology. This paper discusses Microelectromechanical Systems (herein called MEMS) as an integration of mechanical and electronic elements on a common substrate manufactured using today's micro fabrication technology and offering one potential robust solution to this problem. This technology integrates design, engineering and manufacturing methods. These include batch processing methods of integrated circuits, mechanical/electrical/chemical engineering, materials science, plus instrumentation and packaging technologies. Although first demonstrated in the 1960's when Nathanson produced the first batch fabricated MEMS device called the Resonant Gate Transistor (called RGT), progress was slow during the 1970's with the introduction of the first MEMS silicon accelerometer and later the first micro machined inkjet nozzle. Progress in MEMS saw the first experiments in micro machined silicon and more widespread development of blood pressure transducers, accelerometers in air bags for the automotive industry and gyroscopes for inertial navigation. It was not until the 1990's and 2000's that more robust fabrication technologies allowed wider development and distribution of MEMS devices including those which have made for higher reliable, reduced cost and reduced packaging for RF subsystems. Today's micro machined technologies offer developers a key design tool. Since designers recognize the key to higher reliability, and greater product proliferation is to meet goals such as small in size, less power consumption and reduced cost; it is no wonder why this technology is viewed with such great enthusiasm. It should be clear that MEMS have enormous potential for use across a wide range of systems from biomedical, automotive, communications and defense. MEMS will solve many design problems of wireless communications. Also the broad spectrum applications make the cost of fabrication techniques on a micro level possible and affordable. This paper will focus on RF Subsystems, important specifications, some key components and application to ATE.