Improvement of test yield for IC product

Semiconductor testing plant usually increases tester utilization and reduces overkill to increase profits and decreases the cost of replacement parts. Traditionally, IC product test is conducted through the socket pogo pin contact with IC pin or solder ball. Semiconductor test facility solves the oxidation of socket pogo pin, tin slag adhesion, and adhesion of dust and other problems by means of brushing it with a specific cleaning solution. Socket pogo pin is directly to be cleaned by brushing back and forth. This action will cause the gold-plated surface layer of socket pogo pin peeling off. The cleaning fluid flows into the load board along the socket pogo pin will damage the board. These phenomena decrease the life time of socket pogo pin and influence the yield of IC product test. In this study, YAG laser was used to clean the surface oxide, tin-slag, and powder layer of socket pogo pin. This non-contact cleaning method improves the test yield, machine utilization and reduces the testing cost.