Improvement of power integrity in SiP modules with miniaturized electromagnetic bandgap structure

Designed electromagnetic bandgap (EBG) structures are presented for noise suppression in an 8 mm × 8 mm System-in Package (SiP) module. By embeddeding a spiral inductor, the lower suppression frequency can decrease to 2.3 GHz on a 3 × 3 lattice EBG structure. For practical layout consideration, an improved EBG structure with meandering short stubs is proposed to provide a 26.4% fractional bandwidth.