High-performance infrared micro-bolometer arrays manufactured using very large scale heterogeneous integration

This paper reports on the implementation and characterization of arrays of uncooled infrared bolometers containing mono-crystalline Si/SiGe quantum well (QW) thermistors. The bolometer arrays are integrated on silicon fan-out wafers using very-large scale heterogeneous integration that is compatible with standard CMOS wafers. Infrared bolometer arrays with 320×240 pixels and pixel pitches of 25 μm × 25 μm and 17 μm × 17 μm have been implemented, respectively.