Analysis on thermal reliability of key electronic components on PCB board

Electronic equipment develop continuously toward light, thin, small miniaturization trend. With the increased integration of electronic components, and its increasingly high heat density, small size, compact layout, leading to high temperature of electronic components, greatly reducing the service life of components, resulting to job insecurity or failure of components, and then reducing system reliability. Therefore, the thermal design becomes increasingly important. With the thermal reliability as basic, with the heat transfer and fluid dynamics as principle, with the PCB board and several major electronic components of cooling on the board as the research object, study on layout optimization problem of components on PCB board. Establish the corresponding FEM model, then solve the temperature field of the main cooling electronic components on the PCB board with the analysis software-ANSYS, display the high temperature and low temperature areas of PCB board. Realize the layout optimization of the main cooling electronic components on the PCB board, and calculate temperature field of the PCB board of different layout with examples, obtaining the rational layout by comparing. This method does not change the condition of external cooling, but could reduce the maximum working temperature of PCB board and improve the reliability of the system, as well as providing a reference for thermal reliability designing of electronic products.