Exploring ageing effects on integrated power devices (I–V) for health monitoring

Based on 3D FEM electro thermo mechanical simulations (COMSOL) and 2D multi-cells simulation (Sentaurus TCAD), we explore the impact of main ageing phenomena (bonding wire lift off and solder joint delamination) at the origin of power assembly failures, on the electrical characteristics of MOS gated power devices (IGBT, VDMOS). Electrical characteristics variations are analyzed with a view to using them for health monitoring of embedded power assemblies.