Multi-physics analysis of heat-structure on surface resistance

The failure of electronic systems and equipment mostly happens in the welding parts between components and circuit board while the cycles of thermal expansion achieve a certain number, because the solder comes to fatigue cracking. In this paper, a sample about surface resistance was chosen to explain what relationship among the electric field, heat transfer, and structure expansion by using the multi-physics modeling and simulation software, COMSOL Multiphysics, to model these three physical fields in fully coupling. The components of the electric field, temperature field and stress field distribution were extracted to explain the interaction among these three physics fields. According to the results of numerical simulation, the engineer will be inspired to obtain an optimization structure and process.