A study of TSV variation impact on power supply noise

In this work, we study the through-silicon-via (TSV) RC variation impact on 3D power delivery network (PDN). First, we model TSV RC variation due to process variation. Then, we perform sign-off power supply noise analysis of 3D PDN in GDSII layouts which contain power/ground (P/G) TSV RC variation model. We explore the effect of TSV RC variation range, number of variation sources (P/G TSV count), number of C4 bumps and TSV size on the robustness of PDN under TSV RC variation. Our results show that TSV RC variations cause negligible influence on 3D PDN due to much smaller parasitic values of TSVs compared with that of entire PDN.