Temporal instability of suppressor ensembles under reactive conditions

The temporal instability of different types of suppressor additives relevant for Damascene and 3D-TSV copper electroplating is studied by means of potential transient experiments in combination with structure sensitive methods such as in-situ scanning tunneling microscopy and in-situ synchrotron x-ray diffraction. The molecular interplay of various types of suppressor additives with their specific antagonists at the copper/electrolyte interface is discussed in the light of the successful fill of sub-50nm Damascene features and μm-sized 3D-TSVs.