Yield improvement and ramp-up to production of advanced CMOS technologies interconnects

Process complexity of advanced CMOS technologies interconnect increases continuously in the uninterrupted move towards miniaturization and verticalization. In the same time the window market of new more complex consumer products are shrinking faster and faster. This paper gives a comprehensive description of the most relevant and advanced methodologies and tools carried out to achieve quickly a yielding and reliable BEOL interconnect process in most advanced technologies.