Preventing RFIC interference issues: A modeling methodology for floorplan development and verification of isolation- and grounding strategies

In order to prevent interference issues it is essential to make the right choices/trade-offs in the early phases of the IC design. A modeling methodology was developed to study the impact of physical design choices on the isolation behavior of the overall packaged and mounted RF product. This paper gives an overview of the various coupling paths and their relative contribution in the isolation/coupling. The simulation/modeling results are in good agreement with measurements.