Correlation between electrical and mechanical properties of polymer composite

The common features in dielectric and mechanical characteristics of the Epoxy Molding Compound (EMC) were found in temperature dependencies of the dielectric permittivity and the dielectric loss factor obtained in experiments by Electro-Dynamic Analysis (EDA) in comparison with the temperature dependence of storage modulus and mechanical loss factor in Dynamical Mechanical Analysis (DMA). Experimental results obtained give a basis for establishing a correlation between electrical and mechanical characteristics of the material. The relaxation model of the dynamic dielectric and mechanic response is suggested and verified by the experimental results. The same relaxation model has been used for a description of the frequency dependent storage modulus and inverse dielectric permittivity of the EMC sample. The temperature dependence of these parameters was introduced by the temperature dependent relaxation time model. The fitting parameters were found from the DMA and EDA experimental characteristics. A correct description of the mechanical and electrical characteristics of EMC samples in the glass transition temperature area has been obtained.