Backside particle reduction on PI9500 series ion implanter

This paper reports on backside particle reduction the high current ion implantation process using the PI9500 series ion implanter through fluorine (F/sup +/) ion implantation into the surface of the silicone elastomer. When the silicone elastomer is implanted with F/sup +/, backside particles can be less than 300 particles at >0.281 /spl mu/m on a 6" wafer. SEM observation indicated that the surface of the silicone elastomer had been reformed by F/sup +/ implantation, The original silicone elastomer had a rough surface, but after F/sup +/ implantation the surface became smooth. The mechanism for particle generation is discussed below.