Full Sequence Ecmp for Advanced Low Stress Copper Planarization

The planarization of Copper becomes increasingly demanding in advanced multilayer wiring schemes with ultra low-k dielectric isolation. Planarization technology needs to support ultra low surface topography to support next generation lithography depth of focus requirements. Additionally, a significant reduction of across wafer level and die level sheet resistance variation is becoming more critical due to the observed exponential sheet resistance increase with shrinking line geometries. Full sequence electrochemical mechanical planarization (Ecmp) is a revolutionary and new breakaway method for Copper planarization which has the potential to meet process requirements for the next technology nodes.