Wireless power transfer using resonant inductive coupling for 3D integrated ICs

In this paper we introduce a wireless power transfer scheme using resonant inductive coupling for 3DICs to enhance power transfer efficiency and power transfer density with smaller coils. Numerical analysis and optimal conditions are presented for both power transfer efficiency and density. HFSS simulation results are shown to verify the theoretical results. Coils for the power link are designed using a Chartered 0.13μm CMOS process. The peak power transfer efficiency is 52% and power transfer density is 49mW/mm².