CMP oxide slurry recycle system implementation

This paper demonstrates and realizes that the Chemical Mechanical Polishing (CMP) oxide slurry could be recycled to CMP process again. By the slurry recycling process, 90% waste slurry could be reclaimed and also over 90% wastewater could be recycled and reuse in integrated circuits (ICs) process. The demonstrated reclaimed slurry show compatible removal rate (R/R) and the same uniformity (U%) of R/R. Also the compatible R/R profile and defectives level.