Thermopile IR detector with filter cointegrated by wafer bonding technique

A novel micromachined thermopile IR detector module with filter and detector cointegrated by wafer level Au-Au vacuum bonding is presented in this paper. Filter is directly bonded on the IR detector to miniaturize the detector module, as well as reduce the packaging cost. Because the gas convection will be eliminated in vacuum, a better thermal isolation can be achieved for the vacuum packaged IR detector. Measured results show that the vacuum packaged IR detector has a 4 times larger output voltage than the atmosphere packaged IR detector. The bonding strength and hermeticity of the Au-Au bonding have also been investigated, and experiment results imply the good reliability of the IR detector with filter cointegrated.