Misalignment effects in inter-chip wireless connection with open-ring resonators

The large tolerance in the ring alignment is the key for the low-cost assembly of high-frequency IC chips using open-ring resonator wireless interconnection. The effects of the misalignment are investigated by simulation at 60HGz range and by experiments at 15GHz range. It is confirmed that a half of the ring diameter will be the limit for the low-loss transmission.