Evaluation of board level reliability of BGAs under thermal cycling test

Board level reliability is more representative of the reliability of a package operating in the field and fatigue due to loading with cyclical stresses is a major concern in solder joint reliability. In this paper, the board level reliability of two types of BGA packages CTBGA 228 and CABGA 160 under accelerated temperature cycling stress had been studied; each package contains a daisy chained die. Temperature cycling tests from 0°C to +100°C with 10 min dwell time were conducted to failure for all the package types. The cycle to failure was analyzed using two parameters Weibull distribution and also use Moire interferometry to confirm the test result. From Weibull distribution and Moire interferometry results showed that CABGA 160 has longer reliability than CTBGA 228.